Suitable for outer layer masking, pattern electroplating, and inner and outer layer acid-base etching processes
HR-6130 HR-6140 HR-6145
All categories
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HR Series 1 (Hardboard Manufacturing Process)Suitable for outer layer masking, pattern electroplating, and inner and outer layer acid-base etching processes HR-6130 HR-6140 HR-6145 -
HR Series 2 (Soft Board Manufacturing Process)A photosensitive dry film developed for high-density flexible circuit boards Suitable for internal and external acid-base etching processes HR-6015 HR-6020 HR-6025 HR-6030A photosensitive dry film developed for high-density flexible circuit boardsSuitable for internal and external acid-base etching processesHR-6015 HR-6020HR-6025 HR-6030
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HD series (laser direct imaging process)A photosensitive dry film mainly developed for the transfer of graphics between the inner and outer layers of HDI boards, with ultra-high sensitivity, especially suitable for LDI laser direct imaging and LED DI direct imaging processes HD-220 HD-225 HD-230 HD-233 HD-240 HD-245A photosensitive dry film mainly developed for the transfer of graphics between the inner and outer layers of HDI boards, with ultra-high sensitivity, especially suitable for LDI laser direct imaging and LED DI direct imaging processesHD-220 HD-225HD-230 HD-233HD-240 HD-245
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IC carrier board series
Applicable to packaging carrier boards, suitable for MSAP and SAP processes; excellent resolution and adhesion performance, pollution-free, copper plating resistance and nickel plating resistance
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Chemical nickel gold series
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FPC series
HD200 series direct imaging photosensitive dry film
Thickness (um): 38, 40, 48
Application field: Used for laser direct imaging, outer layer acidic direct etching, outer layer graphic electroplating alkaline etching
Main features: high sensitivity, excellent pore covering, good adhesion and analytical ability
HD200L series direct imaging photosensitive dry film
Thickness (um): 24, 29
Application field: for laser direct imaging and acid direct etching
Main features: dual band high sensitivity, superior resolution, adhesion, and development resistance
HR6000 series photosensitive dry film
Thickness (um): 20, 23, 28
Application field: Acid direct corrosion
Main features: Excellent resolution, adhesion, and better wet pressing effect
HR6100M series photosensitive dry film
Thickness (um): 28, 38, 45
Application field: Acid direct etching, mask specific dry film
Main feature: Excellent masking ability
HW8000 series photosensitive dry film
Thickness (um): 20, 23
Application field: Acid direct corrosion, soft board precision circuit
Main features: better resolution and adhesion
HR6100 series photosensitive dry film
Thickness (um): 28, 38, 45
Application field: internal/external acidic direct etching, external graphic electroplating alkaline etching
Main features: Good analytical ability, excellent covering performance, and superior plating resistance
HC600 selective dry film
Thickness (um): 50
Application field: Selective chemical nickel gold dedicated dry film, electroplating thick gold
Main characteristics: excellent adhesion, flow following ability, and anti permeation plating ability, with less precipitation
Dry film for HG900 packaging carrier board
Thickness (um): 24 (available from 10 to 30 according to customer requirements) μ M customization)
Application field: suitable for packaging carrier boards, MSAP, SAP processes
Main characteristics: excellent analytical power and adhesion, pollution-free, resistant to copper plating, nickel plating
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