1
All categories
/
/
IC carrier board series
  • HR Series 1 (Hardboard Manufacturing Process)
    HR Series 1 (Hardboard Manufacturing Process)
    Suitable for outer layer masking, pattern electroplating, and inner and outer layer acid-base etching processes HR-6130 HR-6140 HR-6145
    Suitable for outer layer masking, pattern electroplating, and inner and outer layer acid-base etching processes
    HR-6130  HR-6140  HR-6145
  • HR Series 2 (Soft Board Manufacturing Process)
    HR Series 2 (Soft Board Manufacturing Process)
    A photosensitive dry film developed for high-density flexible circuit boards Suitable for internal and external acid-base etching processes HR-6015 HR-6020 HR-6025 HR-6030
    A photosensitive dry film developed for high-density flexible circuit boards
    Suitable for internal and external acid-base etching processes
    HR-6015  HR-6020
    HR-6025  HR-6030
  • HD series (laser direct imaging process)
    HD series (laser direct imaging process)
    A photosensitive dry film mainly developed for the transfer of graphics between the inner and outer layers of HDI boards, with ultra-high sensitivity, especially suitable for LDI laser direct imaging and LED DI direct imaging processes HD-220 HD-225 HD-230 HD-233 HD-240 HD-245
    A photosensitive dry film mainly developed for the transfer of graphics between the inner and outer layers of HDI boards, with ultra-high sensitivity, especially suitable for LDI laser direct imaging and LED DI direct imaging processes
    HD-220  HD-225  
    HD-230  HD-233 
    HD-240  HD-245
  • IC carrier board series
    IC carrier board series

    Applicable to packaging carrier boards, suitable for MSAP and SAP processes; excellent resolution and adhesion performance, pollution-free, copper plating resistance and nickel plating resistance

  • Chemical nickel gold series
    Chemical nickel gold series
  • FPC series
    FPC series
Dry film for HG900 packaging carrier board

Thickness (um): 24 (available from 10 to 30 according to customer requirements) μ M customization)

Application field: suitable for packaging carrier boards, MSAP, SAP processes

Main characteristics: excellent analytical power and adhesion, pollution-free, resistant to copper plating, nickel plating

Click to see more 白箭头 黑箭头

CONTACT INFORMATION

Address: Second Industrial Park, Loudi Economic and Technological Development Zone, Hunan Province

E-mail:sales@initialnm.com(business)
             
zoulk@initialnm.com(recruit)

Scan and follow us

Scan and follow us

Copyright © 2020 Hunan Initial New Materials Co., Ltd.  All rights reserved.       湘ICP备2020020659号-1      by:www.300.cn changsha